Resin for Polyurethane Synthesis (Biomedical Grade) for use as biomedical implant materials. Storage at +5^oC. Polymerized product is polyurethane highly porous composite, porosity depends on wet content or addition of water in the reagent. The forpolymer could be blended with reinforcing or pore-enhancing additives as micromolded collagen or montmorrilonite.

Film of AB Polyimide for preparation of composite electroisolative filming or fibering materials. High compatibility with polymeric and non-organic additives to use in electroengines and apparatus operating long time within 70-240^oC, shortly up to 600^oC.

Dianhydride of Tricyclodecentetracarbon Acid - Photoadduct of Benzene and Maleic Anhydride (AB) – white or yellowish powder for synthesis of polyimide lacquer.

Lacquer of Polyimide AB_imide for production of heat-protective and electro-isolative coatings, dielectric glue of glass, ceramics and plastics, metallized films, flexible microchips, anticorrosive and anti-acid coatings and other thermostable constructs. Stable within -30 and +50^oC at storage for 3 years. Operating conditions: long-term up to 200^oC and -180^oC; shortly up to 600^oC.

Metallized Polyimide Films – integral or discreet (chip-like) deposition of various metals, such as silver, cobalt, nickel, copper, rhodium, gold, platinum. The metal layer is impregnated into polymer matrix making interlayer adhesion deadly strong. Thickness of films – 25-100 microns, thickness of metal layer – 1000-5000 nm. Optical performances – 80-97% of standard mirror (depending on metal type).
Surface electroresistivity is within 0.1 up to 1,0 Ohm - ρs=0,98(1+2,65•10-3t) between -25 and +200^oC. Dielectric performances – 3.9 (constant), 0.0019 (tangent), 1x1014 Ohmxm (volume resistivity), 210 kV/mm (breakage), 70-100 pF per 1 cm² (capacity)